4-ply board
层数:4; 板厚:1.60±0.16mm; 最小孔径:通孔,0.25mm; 线宽线距:0.114mm/0.139mm; 表面处理:沉镍金
Parameters
Number of layers: 4
Thickness: 1.60±0.16mm
Minimum aperture: through hole: 0.25mm
Line width and line spacing: 0.114 mm/0.139 mm.
Surface treatment: depositing nickel and gold.
Process
高频陶瓷与FR-4不对称混压技术
阻焊防脱落制作技术
高TG
Application
5G通讯基站
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